• Your shopping cart is empty!

PDF Preview

IEC 60749-20 Ed. 3.0 b:2020

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

International Electrotechnical Commission, 08/01/2020

Publisher: IEC

File Format: PDF

$117.00$234.00


Published:01/08/2020

Pages:60

File Size:1 file , 2.5 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.

More IEC standard pdf

IEC 62447-3 Ed. 1.0 en:2007

IEC 62447-3 Ed. 1.0 en:2007

Helical-scan compressed digital video cassette system using 6,35 mm magnetic tape - Format D-12 - Part 3: Data stream format

$72.00 $145.00

IEC 61158-6-20 Ed. 1.0 en:2007

IEC 61158-6-20 Ed. 1.0 en:2007

Industrial communication networks - Fieldbus specifications - Part 6-20: Application layer protocol specification - Type 20 elements

$102.00 $204.00

IEC 60904-9 Ed. 2.0 b:2007

IEC 60904-9 Ed. 2.0 b:2007

Photovoltaic devices - Part 9: Solar simulator performance requirements

$41.00 $82.00

IEC 60976 Ed. 2.0 b:2007

IEC 60976 Ed. 2.0 b:2007

Medical electrical equipment - Medical electron accelerators - Functional performance characteristics

$227.00 $455.00