IEC 60749-20 Ed. 3.0 b:2020

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

International Electrotechnical Commission, 08/01/2020

Publisher: IEC

File Format: PDF

$117.00$234.00


Published:01/08/2020

Pages:60

File Size:1 file , 2.5 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.

More IEC standard pdf

IEC 60475 Ed. 3.0 b:2022

IEC 60475 Ed. 3.0 b:2022

Method of sampling insulating liquids

$117.00 $234.00

IEC 62841-3-6 AMD. 1 Ed. 1.0 b:2022

IEC 62841-3-6 AMD. 1 Ed. 1.0 b:2022

Amendment 1 Electric motor-operated hand-held tools, transportable tools and lawn and garden machinery - Safety - Part 3-6: Particular requirements for transportable diamond drills with liquid system

$25.00 $51.00

IEC 62862-5-2 Ed. 1.0 en:2022

IEC 62862-5-2 Ed. 1.0 en:2022

Solar thermal electric plants - Part 5-2: Systems and components - General requirements and test methods for large-size linear Fresnel collectors

$139.00 $278.00

IEC 62841-3-6 Ed. 1.1 b:2022

IEC 62841-3-6 Ed. 1.1 b:2022

Electric motor-operated hand-held tools, transportable tools and lawn and garden machinery - Safety - Part 3-6: Particular requirements for transportable diamond drills with liquid system CONSOLIDATED EDITION

$114.00 $228.00