IEC 60749-22 Ed. 1.0 b:2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

International Electrotechnical Commission, 09/12/2002

Publisher: IEC

File Format: PDF

$95.00$190.00

Description

Published:12/09/2002

Pages:41

File Size:1 file , 720 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements

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