IEC 60749-22 Ed. 1.0 b:2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

International Electrotechnical Commission, 09/12/2002

Publisher: IEC

File Format: PDF

$95.00$190.00

Description

Published:12/09/2002

Pages:41

File Size:1 file , 720 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements

More IEC standard pdf

IEC 60574-7 Ed. 1.0 b:1987

Audiovisual, video and television equipment and systems. Part 7: Safe handling and operation of audiovisual equipment

$21.00 $42.00

IEC 60654-4 Ed. 1.0 b:1987

Operating conditions for industrial-process measurement and control equipment. Part 4: Corrosive and erosive influences

$47.00 $95.00

IEC 60894 TR Ed. 1.0 b CORR1:1987

Corrigendum 1 - Guide for test procedure for the measurement of loss tangent of coils and bars for machine windings

$133.00 $266.21

IEC 60268-2 Ed. 2.0 b:1987

Sound system equipment. Part 2: Explanation of general terms and calculation methods

$47.00 $95.00