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IEC 60749-25 Ed. 1.0 b:2003

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

International Electrotechnical Commission, 07/11/2003

Publisher: IEC

File Format: PDF

$47.00$95.00


Published:11/07/2003

Pages:25

File Size:1 file , 650 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

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