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IEC 60749-37 Ed. 1.0 b:2008

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

International Electrotechnical Commission, 01/30/2008

Publisher: IEC

File Format: PDF

$66.00$133.00


Published:30/01/2008

Pages:39

File Size:1 file , 1 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.

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