• Your shopping cart is empty!

PDF Preview

IEC 60794-3-30 Ed. 2.0 b:2008

Optical fibre cables - Part 3-30: Outdoor cables - Family specification for optical telecommunication cables for lakes, river crossings and coastal application

International Electrotechnical Commission, 04/29/2008

Publisher: IEC

File Format: PDF

$95.00$190.00


Published:29/04/2008

Pages:46

File Size:1 file , 990 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 60794-3-30:2008 gives this family specification covering optical telecommunication cables to be used as underwater cables for lakes, river crossings and coastal applications. Requirements of the sectional specification IEC 60794-3 for duct, buried, aerial and lake, river crossings and coastal applications cables are applicable to cables covered by this standard. The main changes with respect to the previous edition are
- the title of the specification has been updated to include coastal applications;
- fibres specification have been enlarged to include fibre Type B5; and
- an annex has been added for additional requirements according to the MICE table.

More IEC standard pdf

IEC 60947-5-7 Ed. 1.0 b:2003

IEC 60947-5-7 Ed. 1.0 b:2003

Low-voltage switchgear and controlgear - Part 5-7: Control circuit devices and switching elements - Requirements for proximity devices with analogue output

$47.00 $95.00

IEC 60169-17 Amd.1 Ed. 1.0 b:1993

IEC 60169-17 Amd.1 Ed. 1.0 b:1993

Amendment 1 - Radio-frequency connectors. Part 17: R.F. coaxial connectors with inner diameter of outer conductor 6.5 mm (0.256 in) with screw coupling - Characteristic impedance 50 ohms (Type TNC)

$95.00 $190.00

IEC 60383-1 Ed. 4.0 b:1993

IEC 60383-1 Ed. 4.0 b:1993

Insulators for overhead lines with a nominal voltage above 1000 V - Part 1: Ceramic or glass insulator units for a.c. systems - Definitions, test methods and acceptance criteria

$183.00 $367.00

IEC 60191-6-4 Ed. 1.0 b:2003

IEC 60191-6-4 Ed. 1.0 b:2003

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

$47.00 $95.00