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International Electrotechnical Commission, 09/27/2012
Publisher: IEC
File Format: PDF
$11.00$23.00
Published:27/09/2012
Pages:13
File Size:1 file , 300 KB
Note:This product is unavailable in Ukraine, Russia, Belarus
Specifications for particular types of winding wires - Part 39: Glass-fibre braided resin or varnish-impregnated, bare or enamelled rectangular copper wire, temperature index 180
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Fixed capacitors for use in electronic equipment - Part 20: Sectional specification - Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitors
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Semiconductor devices - Flexible and stretchable semiconductor devices - Part 3: Evaluation of thin film transistor characteristics on flexible substrates under bulging
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Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 2: Test method for defects using optical inspection