IEC 61188-1-2 Ed. 1.0 b:1998

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

International Electrotechnical Commission, 04/29/1998

Publisher: IEC

File Format: PDF

$140.00$281.00


Published:29/04/1998

Pages:83

File Size:1 file , 470 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.

More IEC standard pdf

IEC 61760-1 Ed. 2.0 en:2006

IEC 61760-1 Ed. 2.0 en:2006

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

$103.00 $206.00

IEC 62391-2 Ed. 1.0 b:2006

IEC 62391-2 Ed. 1.0 b:2006

Fixed electric double-layer capacitors for use in electronic equipment - Part 2: Sectional specfication - Electric double layer capacitors for power application

$95.00 $190.00

IEC 61005 Ed. 3.0 b:2014

IEC 61005 Ed. 3.0 b:2014

Radiation protection instrumentation - Neutron ambient dose equivalent (rate) meters

$183.00 $367.00

IEC 60870-6-503 Ed. 3.0 b:2014

IEC 60870-6-503 Ed. 3.0 b:2014

Telecontrol equipment and systems - Part 6-503: Telecontrol protocols compatible with ISO standards and ITU-T recommendations - TASE.2 Services and protocol

$240.00 $481.00