• Your shopping cart is empty!

PDF Preview

IEC 61188-5-1 Ed. 1.0 b:2002

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

International Electrotechnical Commission, 07/12/2002

Publisher: IEC

File Format: PDF

$196.00$392.00


Published:12/07/2002

Pages:141

File Size:1 file , 6.2 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

More IEC standard pdf

IEC 60749-10 Ed. 1.0 b COR. 1:2003

IEC 60749-10 Ed. 1.0 b COR. 1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock

$117.00 $235.81

IEC 60300-3-7 Ed. 1.0 b:1999

IEC 60300-3-7 Ed. 1.0 b:1999

Dependability management - Part 3-7: Application guide - Reliability stress screening of electronic hardware

$55.00 $110.00

IEC 60749-32 Ed. 1.0 b COR. 1:2003

IEC 60749-32 Ed. 1.0 b COR. 1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

$129.00 $259.92

IEC 60835-2-2 Ed. 1.0 b:1994

IEC 60835-2-2 Ed. 1.0 b:1994

Methods of measurement for equipment used in digital microwave transmission systems - Part 2: Measurements on terrestrial radio-relay systems - Section 2: Antenna

$95.00 $190.00