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IEC 61188-5-1 Ed. 1.0 b:2002

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

International Electrotechnical Commission, 07/12/2002

Publisher: IEC

File Format: PDF

$196.00$392.00


Published:12/07/2002

Pages:141

File Size:1 file , 6.2 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

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