IEC 61188-5-2 Ed. 1.0 b:2003

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

International Electrotechnical Commission, 06/24/2003

Publisher: IEC

File Format: PDF

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Description

Published:24/06/2003

Pages:103

File Size:1 file , 1.3 MB

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Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.

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IEC 61188-5-2 Ed. 1.0 b:2003

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

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