Provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints.
More IEC standard pdf
IEC 61119-5 Ed. 1.0 b:1993
Digital audio tape cassette system (DAT) - Part 5: DAT forprofessional use
$72.00 $145.00
IEC 60317-13 Ed. 2.2 b:1997
Specifications for particular types of winding wires - Part 13: Polyester or polyesterimide overcoated with polyamide-imide enamelled round copper wire, class 200 CONSOLIDATED EDITION
$28.00 $56.00
IEC 61176 Ed. 1.0 b:1993
Hand-held electric mains voltage operated circular saws - Methods for measuring the performance
$47.00 $95.00
IEC 60255-27 Ed. 1.0 b:2005
Measuring relays and protection equipment - Part 27: Product safety requirements
$170.00 $341.00