• Your shopping cart is empty!

PDF Preview

IEC 61188-5-6 Ed. 1.0 b:2003

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

International Electrotechnical Commission, 01/23/2003

Publisher: IEC

File Format: PDF

$72.00$145.00


Published:23/01/2003

Pages:37

File Size:1 file , 380 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.

More IEC standard pdf

IEC 17309 Ed. 1.0 en:2000

IEC 17309 Ed. 1.0 en:2000

Information technology -- Telecommunications and information exchange between systems -- Private Integrated Services Network -- Mapping functions for the employment of a circuit mode basic service and the supplementary service user-to-user signalling as a pair of on-demand inter-PINX connections

$67.00 $135.14

IEC 61754-2 Ed. 1.0 b:1996

IEC 61754-2 Ed. 1.0 b:1996

Fibre optic connector interfaces - Part 2: Type BFOC/2,5 connector family

$25.00 $51.00

IEC 17310 Ed. 1.0 en:2000

IEC 17310 Ed. 1.0 en:2000

Information technology -- Telecommunications and information exchange between systems -- Private Integrated Services Network -- Mapping functions for the employment of 64 kbit/s circuit mode connections with 8 kbit/s sub-multiplexing

$67.00 $135.14

IEC 61754-1 Ed. 1.0 b:1996

IEC 61754-1 Ed. 1.0 b:1996

Fibre optic connector interfaces - Part 1: General and guidance

$31.00 $62.00