IEC 61188-5-6 Ed. 1.0 b:2003

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

International Electrotechnical Commission, 01/23/2003

Publisher: IEC

File Format: PDF

$72.00$145.00

Description

Published:23/01/2003

Pages:37

File Size:1 file , 380 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.

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