IEC 61188-5-8 Ed. 1.0 en:2007

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

International Electrotechnical Commission, 10/30/2007

Publisher: IEC

File Format: PDF

$38.00$77.00

Description

Published:30/10/2007

Pages:30

File Size:1 file , 1 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

Provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints.

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