• Your shopping cart is empty!

PDF Preview

IEC 61188-6-1 Ed. 1.0 b:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

International Electrotechnical Commission, 02/23/2021

Publisher: IEC

File Format: PDF

$139.00$278.00


Published:23/02/2021

Pages:63

File Size:1 file , 5.7 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

More IEC standard pdf

IEC 61236 Ed. 1.0 b:1993

IEC 61236 Ed. 1.0 b:1993

Saddles, pole clamps (stick clamps) and accessories for live working

$71.00 $143.00

IEC 60748-2 Ed. 2.0 b:1997

IEC 60748-2 Ed. 2.0 b:1997

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits

$256.00 $512.00

IEC 60317-1 Ed. 3.2 b:1997

IEC 60317-1 Ed. 3.2 b:1997

Specifications for particular types of winding wires - Part 1: Polyvinyl acetal enamelled round copper wire, class 105 CONSOLIDATED EDITION

$28.00 $56.00

IEC 61158-5-20 Ed. 2.0 en:2010

IEC 61158-5-20 Ed. 2.0 en:2010

Industrial communication networks - Fieldbus specifications - Part 5-20: Application layer service definition - Type 20 elements

$101.00 $203.00