IEC 61189-1 Ed. 1.1 b:2001

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology CONSOLIDATED EDITION

International Electrotechnical Commission, 11/22/2001

Publisher: IEC

File Format: PDF

$114.00$228.00

Description

Published:22/11/2001

Pages:51

File Size:1 file , 620 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.

More IEC standard pdf

IEC 61007 Ed. 3.0 b:2020

Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures

$227.00 $455.00

IEC 60598-2-23 Ed. 2.0 b:2020

Luminaires - Part 2-23: Particular requirements - Extra low voltage lighting systems for filament lamps

$47.00 $95.00

IEC 61188-6-2 Ed. 1.0 b:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

$95.00 $190.00

IEC 62769-150-1 Ed. 1.0 b:2021

Field device integration (FDI) - Part 150-1: Profiles - ISA100 WIRELESS

$117.00 $234.00