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IEC 61189-2-807 Ed. 1.0 b:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

International Electrotechnical Commission, 09/01/2021

Publisher: IEC

File Format: PDF

$25.00$51.00


Published:01/09/2021

Pages:22

File Size:1 file , 1 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td)
of base laminate materials using thermogravimetric analysis (TGA).

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