IEC 61189-2 Ed. 2.0 en:2006

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

International Electrotechnical Commission, 05/30/2006

Publisher: IEC

File Format: PDF

$208.00$417.00

Description

Published:30/05/2006

Pages:122

File Size:1 file , 1.2 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

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