• Your shopping cart is empty!

PDF Preview

IEC 61189-3 Ed. 2.0 en:2007

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

International Electrotechnical Commission, 10/09/2007

Publisher: IEC

File Format: PDF

$158.00$317.00


Published:09/10/2007

Pages:118

File Size:1 file , 4.6 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major changes with regard to the previous edition concern the addition of 25 new test methods and the deletion of Annex B.

More IEC standard pdf

IEC 61340-5-1 Ed. 2.0 b Cor.1:2017

IEC 61340-5-1 Ed. 2.0 b Cor.1:2017

Corrigendum 1 - Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements

$130.00 $260.09

IEC 61386-1 Amd.1 Ed. 2.0 b:2017

IEC 61386-1 Amd.1 Ed. 2.0 b:2017

Conduit systems for cable management - Part 1: General requirements

$12.00 $25.00

IEC 60809 Ed. 3.1 b:2017

IEC 60809 Ed. 3.1 b:2017

Lamps for road vehicles - Dimensional, electrical and luminous requirements CONSOLIDATED EDITION

$253.00 $506.00

IEC 60364-7-704 Ed. 3.0 b:2017

IEC 60364-7-704 Ed. 3.0 b:2017

Low-voltage electrical installations - Part 7-704: Requirements for special installations or locations - Construction and demolition site installations

$47.00 $95.00