• Your shopping cart is empty!

PDF Preview

IEC 61189-5-601 Ed. 1.0 b:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

International Electrotechnical Commission, 02/03/2021

Publisher: IEC

File Format: PDF

$139.00$278.00


Published:03/02/2021

Pages:80

File Size:1 file , 3.3 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys.

More IEC standard pdf

IEC 60418-1 Amd.1 Ed. 1.0 b:1976

IEC 60418-1 Amd.1 Ed. 1.0 b:1976

Amendment 1 - Variable capacitors - Part 1: Terms and methods of test

$6.00 $12.00

IEC 60418-2 Ed. 1.0 b:1976

IEC 60418-2 Ed. 1.0 b:1976

Variable capacitors - Part 2: Type specification for variable tuning capacitors - Type A

$41.00 $82.00

IEC 60390A Ed. 1.0 b:1976

IEC 60390A Ed. 1.0 b:1976

First supplement - Dimensions of spindle ends for manually operated electronic components

$28.00 $56.00

IEC 60351-2 Ed. 1.0 b:1976

IEC 60351-2 Ed. 1.0 b:1976

Expression of the properties of cathode-ray oscilloscopes. Part 2: Storage oscilloscopes

$21.00 $42.00