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  • IEC 61190-1-2 Ed. 1.0 b:2002

IEC 61190-1-2 Ed. 1.0 b:2002

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

International Electrotechnical Commission, 03/22/2002

Publisher: IEC

File Format: PDF

$33.00$67.00


Published:22/03/2002

Pages:35

File Size:1 file , 1.3 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

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