• Your shopping cart is empty!

  • IEC 61190-1-3 Amd.1 Ed. 2.0 b:2010

IEC 61190-1-3 Amd.1 Ed. 2.0 b:2010

Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

International Electrotechnical Commission, 06/10/2010

Publisher: IEC

File Format: PDF

$23.00$47.00


Published:10/06/2010

Pages:17

File Size:1 file , 940 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

More IEC standard pdf

IEC 60601-1-2 Ed. 3.0 b:2007

IEC 60601-1-2 Ed. 3.0 b:2007

Medical electrical equipment - Part 1-2: General requirements for basic safety and essential performance - Collateral standard: Electromagnetic compatibility - Requirements and tests

$193.00 $387.00

IEC 62137-1-2 Ed. 1.0 b:2007

IEC 62137-1-2 Ed. 1.0 b:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

$72.00 $145.00

IEC 62080 Ed. 1.1 b:2009

IEC 62080 Ed. 1.1 b:2009

Sound signalling devices for household and similar purposes CONSOLIDATED EDITION

$291.00 $582.00

IEC 60371-3-9 Amd.1 Ed. 1.0 en:2007

IEC 60371-3-9 Amd.1 Ed. 1.0 en:2007

Amendment 1 - Insulating materials based on mica - Part 3: Specifications for individual materials - Sheet 9: Moulding micanite

$10.00 $21.00