IEC 61190-1-3 Amd.1 Ed. 2.0 b:2010

Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

International Electrotechnical Commission, 06/10/2010

Publisher: IEC

File Format: PDF

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Published:10/06/2010

Pages:17

File Size:1 file , 940 KB

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