• Your shopping cart is empty!

  • IEC 61190-1-3 Ed. 1.0 b:2002

IEC 61190-1-3 Ed. 1.0 b:2002

Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

International Electrotechnical Commission, 03/22/2002

Publisher: IEC

File Format: PDF

$55.00$110.00


Published:22/03/2002

Pages:65

File Size:1 file , 590 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).

More IEC standard pdf

IEC 60603-7-4 Ed. 2.0 b:2010

IEC 60603-7-4 Ed. 2.0 b:2010

Connectors for electronic equipment - Part 7-4: Detail specification for 8-way, unshielded, free and fixed connectors, for data transmissions with frequencies up to 250 MHz

$47.00 $95.00

IEC 60794-5 Ed. 1.0 b:2006

IEC 60794-5 Ed. 1.0 b:2006

Optical fibre cables - Part 5: Sectional specification - Microduct cabling for installation by blowing

$27.00 $55.00

IEC 61108-3 Ed. 1.0 en:2010

IEC 61108-3 Ed. 1.0 en:2010

Maritime navigation and radiocommunication equipment and systems - Global navigation satellite systems (GNSS) - Part 3: Galileo receiver equipment - Performance requirements, methods of testing and required test results

$151.00 $303.00

IEC 60603-7-3 Ed. 2.0 b:2010

IEC 60603-7-3 Ed. 2.0 b:2010

Connectors for electronic equipment - Part 7-3: Detail specification for 8-way, shielded, free and fixed connectors, for data transmission with frequencies up to 100 MHz

$47.00 $95.00