• Your shopping cart is empty!

  • IEC 61190-1-3 Ed. 1.0 b:2002

IEC 61190-1-3 Ed. 1.0 b:2002

Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

International Electrotechnical Commission, 03/22/2002

Publisher: IEC

File Format: PDF

$55.00$110.00


Published:22/03/2002

Pages:65

File Size:1 file , 590 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).

More IEC standard pdf

IEC 60870-2-1 Ed. 2.0 b:1995

IEC 60870-2-1 Ed. 2.0 b:1995

Telecontrol equipment and systems - Part 2: Operating conditions - Section 1: Power supply and electromagnetic compatibility

$95.00 $190.00

IEC 60317-39 Amd.2 Ed. 1.0 b:2005

IEC 60317-39 Amd.2 Ed. 1.0 b:2005

Amendment 2 - Specifications for particular types of winding wires - Part 39: Glass-fibre braided resin or varnish impregnated, bare or enamelled rectangular copper wire, temperature index 180

$8.00 $17.00

IEC 60436 Ed. 3.0 b:2004

IEC 60436 Ed. 3.0 b:2004

Electric dishwashers for household use - Methods for measuring the performance

$151.00 $303.00

IEC 60317-40 Amd.2 Ed. 1.0 b:2005

IEC 60317-40 Amd.2 Ed. 1.0 b:2005

Amendment 2 - Specifications for particular types of winding wires - Part 40: Glass-fibre braided resin or varnish impregnated, bare or enamelled rectangular copper wire, temperature index 200

$8.00 $17.00