IEC 61190-1-3 Ed. 2.0 b:2007

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

International Electrotechnical Commission, 04/26/2007

Publisher: IEC

File Format: PDF

$117.00$235.00


Published:26/04/2007

Pages:71

File Size:1 file , 1.1 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 61190-1-3:2007 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an amendment to Table B.1 concerning lead-free solder alloys.

More IEC standard pdf

IEC 60034-18-21 Amd.2 Ed. 1.0 b:1996

IEC 60034-18-21 Amd.2 Ed. 1.0 b:1996

Amendment 2 - Rotating electrical machines - Part 18: Functional evaluation of insulation systems - Section 21: Test procedures for wire-wound windings - Thermal evaluation and classification

$22.00 $44.00

IEC 60191-6-19 Ed. 1.0 b:2010

IEC 60191-6-19 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

$47.00 $95.00

IEC 61084-1 Ed. 1.0 b:1991

IEC 61084-1 Ed. 1.0 b:1991

Cable trunking and ducting systems for electrical installations - Part 1: General requirements

$82.00 $164.00

IEC 62439-1 Ed. 1.0 b:2010

IEC 62439-1 Ed. 1.0 b:2010

Industrial communication networks - High availability automation networks - Part 1: General concepts and calculation methods

$183.00 $367.00