IEC 61191-3 Ed. 1.0 b:1998

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

International Electrotechnical Commission, 08/28/1998

Publisher: IEC

File Format: PDF

$41.00$82.00

Description

Published:28/08/1998

Pages:31

File Size:1 file , 530 KB

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Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

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