IEC 61192-2 Ed. 1.0 b:2003

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

International Electrotechnical Commission, 03/14/2003

Publisher: IEC

File Format: PDF

$176.00$352.00

Description

Published:14/03/2003

Pages:127

File Size:1 file , 5.8 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.

More IEC standard pdf

IEC 60282-2 Ed. 3.0 b:2008

High-voltage fuses - Part 2: Expulsion fuses

$183.00 $367.00

IEC 60317-26 Ed. 2.0 b:1990

Specifications for particular types of winding wires. Part 26: Polyamide-imide enamelled round copper wire, class 200

$11.00 $23.00

IEC 60317-0-3 Ed. 3.0 b:2008

Specifications for particular types of winding wires - Part 0-3: General requirements - Enamelled round aluminium wire

$95.00 $190.00

IEC 60317-29 Ed. 1.0 b:1990

Specifications for particular types of winding wires. Part 29: Polyester or polyesterimide overcoated with polyamide-imide enamelled rectangular copper wire, class 200

$12.00 $25.00