IEC 61249-3-4 Ed. 1.0 b:1999

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film

International Electrotechnical Commission, 02/10/1999

Publisher: IEC

File Format: PDF

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Description

Published:10/02/1999

Pages:27

File Size:1 file , 190 KB

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Gives requirements for flexible polyimide films coated on one side or both sides with acrylic or epoxide type adhesive for use in the fabrication of flexible printed wiring. Films coated on only one side are used as a coverlay or covercoat in the fabrication of flexible printed wiring. This coverlay or covercoat is also used to provide local support to areas subjected to mechanical or environmental stress. Films coated on both sides are used as bonding films in the fabrication of printed boards.

IEC 61249-3-4 Ed. 1.0 b:1999

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film

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