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International Electrotechnical Commission, 09/28/1994
Publisher: IEC
File Format: PDF
$38.00$76.00
Published:28/09/1994
Pages:39
File Size:1 file , 1.4 MB
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Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
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Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 12: Requirements for polyethylene and polypropylene film tapes with pressure sensitive adhesive
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Multicore and symmetrical pair/quad cables for broadband digital communications (high bit rate digital access telecommunication networks) - Outside plant cables - Part 5: Filled drop cables - Sectional specification
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