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International Electrotechnical Commission, 08/27/2004
Publisher: IEC
File Format: PDF
$12.00$25.00
Published:27/08/2004
Pages:13
File Size:1 file , 100 KB
Note:This product is unavailable in Ukraine, Russia, Belarus
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
$139.00 $278.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
$95.00 $190.00
Explosive atmospheres - Part 29-2: Gas detectors - Selection, installation, use and maintenance of detectors for flammable gases and oxygen
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Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
