IEC 61837-1 Ed. 1.0 b:1999

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines

International Electrotechnical Commission, 05/07/1999

Publisher: IEC

File Format: PDF

$77.00$154.00


Published:07/05/1999

Pages:53

File Size:1 file , 310 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Deals with standard outlines and terminal lead connections as they apply to surface mounted devices for frequency control and selection in plastic moulded enclosures and is based on IEC 61240.

More IEC standard pdf

IEC 60664-5 Ed. 2.0 b:2007

IEC 60664-5 Ed. 2.0 b:2007

Insulation coordination for equipment within low-voltage systems - Part 5: Comprehensive method for determining clearances and creepage distances equal to or less than 2 mm

$139.00 $278.00

IEC 60747-9 Ed. 2.0 b:2007

IEC 60747-9 Ed. 2.0 b:2007

Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs)

$158.00 $317.00

IEC 61628-2 Ed. 1.1 b:2007

IEC 61628-2 Ed. 1.1 b:2007

Corrugated pressboard and presspaper for electrical purposes - Part 2: Methods of test CONSOLIDATED EDITION

$69.00 $139.00

IEC 62132-3 Ed. 1.0 b:2007

IEC 62132-3 Ed. 1.0 b:2007

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method

$58.00 $117.00