IEC 62047-16 Ed. 1.0 b:2015

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

International Electrotechnical Commission, 03/05/2015

Publisher: IEC

File Format: PDF

$25.00$51.00

Description

Published:05/03/2015

Pages:21

File Size:1 file , 420 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.

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