IEC 62137-1-1 Ed. 1.0 b:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

International Electrotechnical Commission, 07/11/2007

Publisher: IEC

File Format: PDF

$47.00$95.00

Description

Published:11/07/2007

Pages:30

File Size:1 file , 1000 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

More IEC standard pdf

IEC 60974-8 Ed. 3.0 b:2021

Arc welding equipment - Part 8: Gas consoles for welding and plasma cutting systems

$72.00 $145.00

IEC 62148-21 Ed. 2.0 en:2021

Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

$47.00 $95.00

IEC 62040-3 Ed. 3.0 en:2021

Uninterruptible power systems (UPS) - Part 3: Method of specifying the performance and test requirements

$227.00 $455.00

IEC 60947-4-1 Cor.2 Ed. 4.0 b:2021

Corrigendum 2 - Low-voltage switchgear and controlgear - Part 4-1: Contactors and motor-starters - Electromechanical contactors and motor-starters

$112.00 $225.63