IEC 62137-4 Ed. 1.0 b:2014

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

International Electrotechnical Commission, 10/09/2014

Publisher: IEC

File Format: PDF

$164.00$329.00

Description

Published:09/10/2014

Pages:85

File Size:1 file , 1.2 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 62137-4:2014 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress. This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and consumer electrical or electronic equipment. IEC 62137-4 includes the following significant technical changes with respect to IEC 62137:2004:
- test conditions for use of lead-free solder are included;
- test conditions for lead-free solders are added;
- accelerations of the temperature cycling test for solder joints are added.

More IEC standard pdf

IEC 61260-3 Ed. 1.0 b:2016

Electroacoustics - Octave-band and fractional-octave-band filters - Part 3: Periodic tests

$95.00 $190.00

IEC 61892-7 Ed. 3.0 b:2014

Mobile and fixed offshore units - Electrical installations - Part 7: Hazardous areas

$176.00 $352.00

IEC 60603-7-41 Ed. 1.0 b:2010

Connectors for electronic equipment - Part 7-41: Detail specification for 8-way, unshielded, free and fixed connectors, for data transmissions with frequencies up to 500 MHz

$47.00 $95.00

IEC 61557-16 Ed. 1.0 b:2014

Electrical safety in low voltage distribution systems up to 1 000 V a.c. and 1 500 V d.c - Equipment for testing, measuring or monitoring of protective measures - Part 16: Equipment for testing the effectiveness of the protective measures of electrical equipment and/or medical electrical equipment

$72.00 $145.00