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IEC 62148-21 Ed. 2.0 b:2021

Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

International Electrotechnical Commission, 04/01/2021

Publisher: IEC

File Format: PDF

$47.00$95.00


Published:01/04/2021

Pages:30

File Size:1 file , 1.6 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 62148 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative.

The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.

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