• IEC 62148-21 Ed. 2.0 en:2021

IEC 62148-21 Ed. 2.0 en:2021

Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

International Electrotechnical Commission, 04/22/2021

Publisher: IEC

File Format: PDF

$47.00$95.00


Published:22/04/2021

Pages:13

File Size:1 file , 1.6 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 62148-21:2021 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.

More IEC standard pdf

IEC 60191-2Z Ed. 1.0 en:2000

IEC 60191-2Z Ed. 1.0 en:2000

Twenty-fourth supplement to Publication 60191-2 (1966) MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - Part 2: Dimensions

$25.00 $50.00

IEC 60191-6-3 Ed. 1.0 b:2000

IEC 60191-6-3 Ed. 1.0 b:2000

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

$72.00 $145.00

IEC 60216-4-1 Ed. 4.0 en:2006

IEC 60216-4-1 Ed. 4.0 en:2006

Electrical insulating materials - Thermal endurance properties - Part 4-1: Ageing ovens - Single-chamber ovens

$72.00 $145.00

IEC 62341-6-2 Ed. 1.0 b:2012

IEC 62341-6-2 Ed. 1.0 b:2012

Organic light emitting diode (OLED) displays - Part 6-2: Measuring methods of visual quality and ambient performance

$139.00 $278.00