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IEC 62258-6 Ed. 1.0 en:2006

Semiconductor die products - Part 6: Requirements for information concerning thermal simulation

International Electrotechnical Commission, 08/28/2006

Publisher: IEC

File Format: PDF

$25.00$51.00


Published:28/08/2006

Pages:9

File Size:1 file , 260 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2.

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