IEC 62769-4 Ed. 1.0 b:2015

Field Device Integration (FDI) - Part 4: FDI Packages

International Electrotechnical Commission, 05/12/2015

Publisher: IEC

File Format: PDF

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Description

Published:12/05/2015

Pages:167

File Size:1 file , 1.2 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 62769-4:2015 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure.

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