IEC 62769-4 Ed. 2.0 b:2021

Field Device Integration (FDI) - Part 4: FDI Packages

International Electrotechnical Commission, 02/05/2021

Publisher: IEC

File Format: PDF

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Description

Published:05/02/2021

Pages:165

File Size:1 file , 4.3 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 62769-4:2021 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure.

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