IEC 62769-6-100 Ed. 1.0 b:2023

Field Device Integration (FDI®) – Part 6-100: Technology Mapping – .Net

International Electrotechnical Commission, 04/01/2023

Publisher: IEC

File Format: PDF

$117.00$234.00


Published:01/04/2023

Pages:58

File Size:1 file , 1.2 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 62769 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®1) standard. The technology mapping focuses on implementation regarding the components FDI® Client and User Interface Plug-in (UIP) using the Runtime .NET. This runtime is specific only to the WORKSTATION platform as defined in IEC 62769-4.

More IEC standard pdf

IEC 60748-4-2 Ed. 1.0 b:1993

IEC 60748-4-2 Ed. 1.0 b:1993

Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue-to-digital converters (ADC)

$72.00 $145.00

IEC 62196-2 Ed. 1.0 b:2011

IEC 62196-2 Ed. 1.0 b:2011

Plugs, socket-outlets, vehicle connectors and vehicle inlets - Conductive charging of electric vehicles - Part 2: Dimensional compatibility and interchangeability requirements for a.c. pin and contact-tube accessories

$127.00 $254.00

IEC 60774-2 Ed. 1.0 b:1999

IEC 60774-2 Ed. 1.0 b:1999

Helical-scan video tape cassette system using 12,65 mm (0,5 in) magnetic tape on type VHS - Part 2: FM audio recording

$25.00 $51.00

IEC 61290-4-1 Ed. 1.0 b:2011

IEC 61290-4-1 Ed. 1.0 b:2011

Optical amplifiers - Test methods - Part 4-1: Gain transient parameters - Two-wavelength method

$60.00 $121.00