IEC 62769-8 Ed. 1.0 b:2023

Field device integration (FDI®) – Part 8: EDD to OPC-UA Mapping

International Electrotechnical Commission, 04/01/2023

Publisher: IEC

File Format: PDF

$183.00$367.00


Published:01/04/2023

Pages:110

File Size:1 file , 2.4 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 62769 specifies how the internal view of a device model represented by the EDD can be transferred into an external view as an OPC-UA information model by mapping EDD constructs to OPC-UA objects.

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