• Your shopping cart is empty!

PDF Preview

IEC 62878-1 Ed. 1.0 b:2019

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

International Electrotechnical Commission, 10/14/2019

Publisher: IEC

File Format: PDF

$72.00$145.00


Published:14/10/2019

Pages:38

File Size:1 file , 1.6 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.

This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.

More IEC standard pdf

IEC 61100 Ed. 1.0 b:1992

IEC 61100 Ed. 1.0 b:1992

Classification of insulating liquids according to fire-point and net calorific value

$18.00 $36.00

IEC 60050-702 Ed. 1.0 b CORR1:1992

IEC 60050-702 Ed. 1.0 b CORR1:1992

Corrigendum 1 - International Electrotechnical Vocabulary - Chapter 702: Oscillations, signals and related devices

$131.00 $263.44

IEC 60317-2 Amd.1 Ed. 3.0 b:1997

IEC 60317-2 Amd.1 Ed. 3.0 b:1997

Amendment 1 - Specifications for particular types of winding wires. Part 2: Solderable polyurethane enamelled round copper wire, class 130, with a bonding layer

$11.00 $23.00

IEC 61158-6-12 Ed. 2.0 en:2010

IEC 61158-6-12 Ed. 2.0 en:2010

Industrial communication networks - Fieldbus specifications - Part 6-12: Application layer protocol specification - Type 12 elements

$164.00 $328.00