Your shopping cart is empty!
PDF Preview
International Electrotechnical Commission, 10/01/2019
Publisher: IEC
File Format: PDF
$72.00$145.00
Published:01/10/2019
Pages:24
File Size:1 file , 1.2 MB
Note:This product is unavailable in Ukraine, Russia, Belarus
This part of IEC 62878 specifies the generic requirements and test methods for device embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
OPC Unified Architecture - Part 11: Historical Access
$140.00 $281.00
Amendment 1 - Lamp controlgear - Part 2-13: Particular requirements for d.c. or a.c. supplied electronic controlgear for LED modules
$6.00 $13.00
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
$164.00 $329.00
International Electrotechnical Vocabulary (IEV) - Part 511: Nano-enabled electrotechnical products and systems
$25.00 $51.00
