IEC 62878-2-602 Ed. 1.0 b:2021

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

International Electrotechnical Commission, 06/01/2021

Publisher: IEC

File Format: PDF

$47.00$95.00


Published:01/06/2021

Pages:28

File Size:1 file , 4.9 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 62878 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.

More IEC standard pdf

IEC 61010-2-020 Amd.1 Ed. 1.0 b:1996

IEC 61010-2-020 Amd.1 Ed. 1.0 b:1996

Amendment 1 - Safety requirements for electrical equipment for measurement, control, and laboratory use - Part 2-020: Particular requirements for laboratory centrifuges

$10.00 $20.00

IEC 60191-2X Ed. 1.0 b COR. 1:2000

IEC 60191-2X Ed. 1.0 b COR. 1:2000

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

$110.00 $220.42

IEC 61690-1 Ed. 1.0 en:2000

IEC 61690-1 Ed. 1.0 en:2000

Electronic design interchange format (EDIF) - Part 1: Version 3 0 0. (This publication is available in electronic HTML format only)

$221.00 $443.00

IEC 60512-12-6 Ed. 1.0 b:1996

IEC 60512-12-6 Ed. 1.0 b:1996

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering

$12.00 $25.00