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International Electrotechnical Commission, 08/01/2023
Publisher: IEC
File Format: PDF
$47.00$95.00
Published:01/08/2023
Pages:18
File Size:1 file , 670 KB
Note:This product is unavailable in Ukraine, Russia, Belarus
This part of IEC 62899 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.
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