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IEC 63068-4 Ed. 1.0 en:2022

Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 4: Procedure for identifying and evaluating defects using a combined method of optical inspection and photoluminescence

International Electrotechnical Commission, 07/01/2022

Publisher: IEC

File Format: PDF

$95.00$190.00


Published:01/07/2022

Pages:30

File Size:1 file , 7.9 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 63068 provides a procedure for identifying and evaluating defects in as-grown 4H-SiC (Silicon Carbide) homoepitaxial wafer by systematically combining two test methods of optical inspection and photoluminescence (PL). Additionally, this document exemplifies optical inspection and PL images to enable the detection and categorization of defects in SiC homoepitaxial wafers.

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