Your shopping cart is empty!
Association Connecting Electronics Industries, 05/01/2003
Publisher: IPC
File Format: PDF
$86.00$173.00
Published:01/05/2003
Pages:161
File Size:1 file , 2.5 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)
$48.00 $97.00
Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B
$86.00 $173.00
Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
Printed Wiring Board Strain Gage Test Guideline