• IPC 0040

IPC 0040

Optoelectronics Assembly and Packaging Technology

Association Connecting Electronics Industries, 05/01/2003

Publisher: IPC

File Format: PDF

$86.00$173.00


Published:01/05/2003

Pages:161

File Size:1 file , 2.5 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner in which these parts will become an integral part of the functioning module, board or subassembly.

More IPC standard pdf

IPC 9641

IPC 9641

High Temperature Printed Board Flatness Guideline

$50.00 $101.00

IPC 4203A

IPC 4203A

Cover and Bonding Material for Flexible Printed Circuitry

$71.00 $142.00

IPC 5703

IPC 5703

Cleanliness Guidelines for Printed Board Fabricators

$50.00 $101.00

IPC 4412B

IPC 4412B

Specification for Finished Fabric Woven from "E" Glass for Printed Boards

$50.00 $101.00