• Your shopping cart is empty!

PDF Preview

IPC 1601

Printed Board Handling and Storage Guidelines

Association Connecting Electronics Industries, 08/01/2010

Publisher: IPC

File Format: PDF

$48.00$97.00


Published:01/08/2010

Pages:28

File Size:1 file , 1.1 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, establishing recommended moisture levels, establishing baking profiles for moisture removal and the impact of baking on printed board solderability.

More IPC standard pdf

IPC 4101C

IPC 4101C

Specification for Base Materials for Rigid and Multilayer Printed Boards

$91.00 $182.00

IPC 9703

IPC 9703

Mechanical Shock Test Guidelines for Solder Joint Reliability

$86.00 $173.00

IPC 6017

IPC 6017

Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices

$50.00 $101.00

IPC 4553A

IPC 4553A

Specification for Immersion Silver Plating for Printed Boards

$91.00 $182.00