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Association Connecting Electronics Industries, 05/08/2017
Publisher: IPC
File Format: PDF
$76.00$153.00
Published:08/05/2017
Pages:44
File Size:1 file , 700 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Design and Assembly Process Implementation of 3D Components
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Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
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Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
The Global Standard for Machine-to-Machine Communication in SMT Assembly Version 1.5
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