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Association Connecting Electronics Industries, 11/01/2020
Publisher: IPC
File Format: PDF
$91.00$182.00
Published:01/11/2020
Pages:48
File Size:1 file , 870 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
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Test Methods for Characterization of Printed Board Assembly Pad Cratering
Printed Board Handling and Storage Guidelines
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Generic Requirements for Surface Mount Design and Land Pattern Standard