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Association Connecting Electronics Industries, 03/01/1998
Publisher: IPC
File Format: PDF
$98.00$197.00
Published:01/03/1998
Pages:24
File Size:1 file , 900 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
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Monotonic Bend Characterization of Board-Level Interconnects with Amendment 1
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Design and Assembly Process Implementation for Embedded Components
Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices