IPC 2222

Sectional Standard on Rigid PWB Design

Association Connecting Electronics Industries, 03/01/1998

Publisher: IPC

File Format: PDF

$98.00$197.00


Published:01/03/1998

Pages:24

File Size:1 file , 900 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

Establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to single, double or multi-layered boards. Key concepts in this document are: rigid laminate properties, designer/end user materials section map, and scoring parameters. This document should be used in conjunction with IPC- 2221.

More IPC standard pdf

IPC T-50M

IPC T-50M

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

$91.00 $182.00

IPC 9702-WAM1

IPC 9702-WAM1

Monotonic Bend Characterization of Board-Level Interconnects with Amendment 1

$50.00 $101.00

IPC 7092

IPC 7092

Design and Assembly Process Implementation for Embedded Components

$91.00 $182.00

IPC J-STD-020E

IPC J-STD-020E

Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

$50.00 $101.00