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Association Connecting Electronics Industries, 09/01/2017
Publisher: IPC
File Format: PDF
$91.00$182.00
Published:01/09/2017
Pages:48
File Size:1 file , 2.8 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - Amendment 1
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Acceptability of Electronic Assemblies
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Guideline Methodology for Assessing Component and Cleaning Materials Compatibility
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Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
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