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Association Connecting Electronics Industries, 10/01/2022
Publisher: IPC
File Format: PDF
$59.00$118.00
Published:01/10/2022
Pages:36
File Size:1 file , 3.6 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This standard establishes the specific requirements for the design of rigid, flexible and rigid-flexible printed boards utilizing radio frequency (RF) and/or Microwave circuity and/or high frequency laminates where RF transmission lines and related passive metal layers are considered as distributed circuits, instead of conventional lumped circuit elements. This standard is used to support product typically requiring materials meeting the requirements of IPC-4103 and fabricated to the requirements of IPC-6018.
Sectional Requirements for Implementation of Assembly In-Circuit Test Data Description
$43.00 $86.00
Sectional Requirements for Implementation of Parts List Product Manufacturing Data Description
Sectional Requirements for Implementation of Administrative Methods for Mfg. Data Description
Sectional Requirements for Implementation of Printed Board Fabrication Data Description
