Your shopping cart is empty!
PDF Preview
Association Connecting Electronics Industries, 10/01/2022
Publisher: IPC
File Format: PDF
$59.00$118.00
Published:01/10/2022
Pages:36
File Size:1 file , 3.6 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This standard establishes the specific requirements for the design of rigid, flexible and rigid-flexible printed boards utilizing radio frequency (RF) and/or Microwave circuity and/or high frequency laminates where RF transmission lines and related passive metal layers are considered as distributed circuits, instead of conventional lumped circuit elements. This standard is used to support product typically requiring materials meeting the requirements of IPC-4103 and fabricated to the requirements of IPC-6018.
Hand Soldering for Through-Hole Components with Training Certification, DVD
$321.00 $643.00
Performance Standard for Ball Grid Array Balls (IPC/EIA J-STD-032)
$46.00 $93.00
Design Guide for RF/Microwave Circuit Boards
$50.00 $101.00
Specifications for Base Materials for Rigid and Multilayer Printed Boards (Includes Amendment 1)
$86.00 $173.00
